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EMC/EMI Shielding/Grounding for Chip & PCB Layout


Description

Five 90-minute sessions. This seminar discusses techniques for identifying the sources of unwanted coupling and radiation, and systematic approaches for their minimization. 

Objectives:

  • Define electromagnetic compatibility.
  • Identify sources of coupling and radiation.
  • Discuss and simulate the effectiveness of various shielding strategies.

Target Audience:

Product and package design engineers of all expertise levels will benefit from this course. A basic engineering background (BSEE or equivalent) is required.


CatalogID: 140

Content
  • 140 Lecture 1
  • 140 Lecture 2
  • 140 Lecture 3
  • 140 Lecture 4
  • 140 Lecture 5
Completion rules
  • All units must be completed